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Thermo Siphon

Semiconductor Chilling Plate Thermosiphon

Air Cool Thermo Siphon Liquid Cool Thermosiphon Semiconductor Chilling Plate Thermosiphon

Semiconductor Chilling Plate Thermosiphon

Ambient Temperature -40℃ ～ 72℃（-40℉ to 161.6 ℉ ）
Refrigerant Temperature -40°C to 150°C (-40°F to 302°F)
Burst Pressure ≥10MPa
Working Medium R134a\ R600a\ R1234ze and other commonly used refrigerant, Fluorinated liquid.
Mounting Rivet, Bracket, Reserve holes according to customer needs
Coating Grey powder, black powder, black electrophoresis, passivation
Application Photovoltaic, wind power and other IGBT heat dissipation, photovoltaic, wind power, data center and other irregular space heat dissipation, all kinds of chips, semiconductor heat dissipation.

The thermo Siphon is based on the two-phase change technology. By injecting refrigerant into the cold plate, the heat of IGBT is transfered into the heat exchanger with larger area for heat dissipation. It relies on gravity drive, only the fan consumes electricity, and its power consumption is only 1/10 of the traditional system, energy saving.

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